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| About the Journal of Micro/Nanolithography, MEMS, and MOEMS |
Editor-in-Chief
Burn J. Lin
TSMC, Ltd. Fab 12
No. 6, Li-Hsin Rd. 6
Science-Based Industrial Park
Hsin-Chu, Taiwan 300-77
Taiwan
886-3-666-5858
Fax 886 3563 7386
E-mail: burnlin@tsmc.com.tw
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Editorial
Board
Scope
The Journal of Micro/Nanolithography, MEMS, and MOEMS
(JM3) publishes peer-reviewed papers on the development
of lithographic, fabrication, packaging, and integration technologies
necessary to address the future needs of the electronics, micro-opto-electro-mechanical
(MEMS and MOEMS), and photonics industries. The scope is broad to
facilitate synergy and interest between the communities served by
the journal. The following topical areas will be covered in JM3:
Microlithography
The emphasis of this section is on the tools, processes, and materials
associated with the lithography of structures that have submicrometer
features. Key topics include optical lithography, emerging lithographic
systems and techniques, resolution enhancement techniques, innovative
illumination and aperture filtering schemes, anti-reflection coatings,
optical proximity correction, CD control, alignment, defect reduction,
yield improvement, resist technology and processing, metrology, inspection,
binary and phase-shifting mask technology, and modeling.
Microfabrication and Micromachining
The emphasis of this section is on technologies to shape three-dimensional
structures leading to the fabrication of active and passive electronic,
electromechanical, optoelectronic, and opto-electro-mechanical devices,
as well as passive optical devices. Key topics include etching and
patterning technologies, plating technologies, replication, surface
micromachining, bulk micromachining, focused ion beam technologies,
fabrication and lithography for three-dimensional systems, MEMS/MOEMS,
and micro-optics.
Microsystems
The emphasis of this section is on core processes and technologies
necessary for packaging and integration, with a focus on wafer-scale
and other volume integration methods. Key topics include novel package
design, modeling, enabling materials, interconnect technology, integration
processes, wafer-scale packaging, three-dimensional packaging, active
and passive alignment, alignment structures, microassembly, structural
integrity, microcooling systems, as well as microsystem design and
applications.
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